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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Packaging of an electronic-microfluidic hybrid sensor

✍ Scribed by Erik Jung, ; Assmann, R.; Aschenbrenner, R.; Reichi, H.

Book ID: 126722287
Publisher: IEEE
Year: 2003
Weight: 399 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ECTC.2003.1216304

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