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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Board level drop test and simulation of TFBGA packages for telecommunication applications

✍ Scribed by Tong Yan Tee, ; Hun Shen Ng, ; Chwee Teck Lim, ; Pek, E.; Zhaowei Zhong,

Book ID: 120815814
Publisher: IEEE
Year: 2003
Weight: 811 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ECTC.2003.1216266

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