𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-vias

✍ Scribed by Tanaka, N.; Yamaji, Y.; Sato, T.; Takahashi, K.

Book ID: 126627370
Publisher: IEEE
Year: 2003
Weight: 636 KB
Category: Article
ISBN-13: 9780780377912
DOI: 10.1109/ECTC.2003.1216342

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 53rd Electronic Components and Tec

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Packaging of an electronic-microfluidic hybrid sensor

✍ Erik Jung, ; Assmann, R.; Aschenbrenner, R.; Reichi, H. 📂 Article 📅 2003 🏛 IEEE ⚖ 399 KB

[IEEE 53rd Electronic Components and Tec

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Multipart optical filter packages for DWDM applications

✍ Muller, H.G.; Townley-Smith, P.; Hellman, S. 📂 Article 📅 2003 🏛 IEEE ⚖ 282 KB

[IEEE 53rd Electronic Components and Tec

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Multilayer power delivery network design for high-speed microprocessor system

✍ Scong-Geun Park, ; JiSeong Kim, ; Jong-Gwan Yook, ; Han-Kyu Park, 📂 Article 📅 2003 🏛 IEEE ⚖ 554 KB

[IEEE 53rd Electronic Components and Tec

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages

✍ Perkins, A.; Sitaraman, S.K. 📂 Article 📅 2003 🏛 IEEE ⚖ 713 KB

[IEEE 53rd Electronic Components and Tec

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Fluxless flip chip technique with Sn-rich Au/Sn solder bumps

✍ Dongwook Kim, ; Chin C. Lee, ; Sokolowski, W.M. 📂 Article 📅 2003 🏛 IEEE ⚖ 401 KB

[IEEE 53rd Electronic Components and Tec

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Board level drop test and simulation of TFBGA packages for telecommunication applications

✍ Tong Yan Tee, ; Hun Shen Ng, ; Chwee Teck Lim, ; Pek, E.; Zhaowei Zhong, 📂 Article 📅 2003 🏛 IEEE ⚖ 811 KB