𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Generic thermal modeling study of the impact of 3D -interposer material and thickness options on the thermal performance and die-to-die thermal coupling

✍ Scribed by Oprins, H.; Beyne, E.

Book ID: 126510509
Publisher: IEEE
Year: 2014
Weight: 794 KB
Category: Article
ISBN: 1479952672
DOI: 10.1109/ITHERM.2014.6892266

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