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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Air cooling limits of 3D stacked logic processor and memory dies

✍ Scribed by Kumari, Niru; Shih, Rocky; Escobar-Vargas, Sergio; Cader, Tahir; Govyadinov, Alexander; Anthony, Sarah; Bash, Cullen

Book ID: 126509869
Publisher: IEEE
Year: 2014
Weight: 579 KB
Category: Article
ISBN: 1479952672
DOI: 10.1109/ITHERM.2014.6892269

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