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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal analysis and optimization of 2.5D and 3D integrated systems with Wide I/O memory

✍ Scribed by Heinig, Andy; Fischbach, Robert; Dittrich, Michael

Book ID: 127015661
Publisher: IEEE
Year: 2014
Weight: 820 KB
Category: Article
ISBN: 1479952672
DOI: 10.1109/itherm.2014.6892268

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