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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Optimizing package IHS flatness & load for improved thermal/mechanical performance

✍ Scribed by Smith, Susan F; Smalley, Jeffory; Tao Liu,

Book ID: 126676043
Publisher: IEEE
Year: 2014
Weight: 556 KB
Category: Article
ISBN: 1479952672
DOI: 10.1109/ITHERM.2014.6892381

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