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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Two phase convective cooling for ultra-high power dissipation in microprocessors

โœ Scribed by Kottke, Peter A.; Yun, Thomas M.; Green, Craig E.; Joshi, Yogendra K.; Fedorov, Andrei G.


Book ID
127142523
Publisher
IEEE
Year
2014
Weight
559 KB
Category
Article
ISBN
1479952672

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