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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Two phase convective cooling for ultra-high power dissipation in microprocessors

✍ Scribed by Kottke, Peter A.; Yun, Thomas M.; Green, Craig E.; Joshi, Yogendra K.; Fedorov, Andrei G.

Book ID: 127142523
Publisher: IEEE
Year: 2014
Weight: 559 KB
Category: Article
ISBN: 1479952672
DOI: 10.1109/itherm.2014.6892282

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