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[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Reliable integration of robust porous ultra low-k (ULK) for the advanced BEOL interconnect

✍ Scribed by Han, Kyu-Hee; Choi, Seungwook; Yim, Tae Jin; Choi, Seunghyuk; Baek, Jongmin; Ahn, Sang Hoon; Lee, Nae-In; Choi, Siyoung; Kang, Ho-Kyu; Jung, E S

Book ID: 121703434
Publisher: IEEE
Year: 2013
Weight: 577 KB
Category: Article
ISBN: 1479904384
DOI: 10.1109/iitc.2013.6615552

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