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[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Novel through-silicon via technologies for 3D system integration

✍ Scribed by Thadesar, Paragkumar A.; Dembla, Ashish; Brown, Devin; Bakir, Muhannad S.

Book ID: 121299647
Publisher: IEEE
Year: 2013
Weight: 865 KB
Category: Article
ISBN: 1479904384
DOI: 10.1109/IITC.2013.6615595

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