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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Effects of overlaying dielectric layer and its local geometry on TSV-induced KOZ in 3D IC

✍ Scribed by Huang, P. S.; Tsai, M. Y.; Lin, P. C.

Book ID: 125424537
Publisher: IEEE
Year: 2013
Weight: 828 KB
Category: Article
ISBN: 1479906670
DOI: 10.1109/impact.2013.6706645

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