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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thin wafer handling and chip to wafer stacking technologies

✍ Scribed by Pauzenberger, Gunter; Uhrmann, Thomas; Wimplinger, Markus; Matthias, Thorsten; Su, Kevin; Tsai, TseMin

Book ID: 121814138
Publisher: IEEE
Year: 2013
Weight: 702 KB
Category: Article
ISBN: 1479906670
DOI: 10.1109/IMPACT.2013.6706632

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