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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Actual stresses around TSV in whole 3D-SiP under reflow or power ON/OFF thermal load

✍ Scribed by Kinoshita, Takahiro; Kawakami, Takashi; Wakamatsu, Takeshi; Shima, Shunpei; Matsumoto, Keiji; Kohara, Sayuri; Yamada, Fumiaki; Orii, Yasumitsu

Book ID: 126616012
Publisher: IEEE
Year: 2012
Weight: 770 KB
Category: Article
ISBN: 1467316377
DOI: 10.1109/IMPACT.2012.6420223

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