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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Study on manufacturing process of semi-flex Printed Circuit Board using buried material

✍ Scribed by Xuemei He, ; Wei He, ; Xinhong Su, ; Yongshuan Hu, ; Yong Huang, ; Minjie Ning, ; Lijuan Cheng,

Book ID: 124095978
Publisher: IEEE
Year: 2012
Weight: 785 KB
Category: Article
ISBN: 1467316377
DOI: 10.1109/IMPACT.2012.6420215

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