𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects

✍ Scribed by Weerasekera, R.; Cubillo, J. R.; Katti, G.

Book ID: 126734248
Publisher: IEEE
Year: 2012
Weight: 798 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507115

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE 14th Electronics Packagi

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Through-Silicon Interposer (TSI) co-design optimization for high performance systems

✍ Cubillo, J. R.; Weerasekera, R.; Katti, G.; Patti, R. 📂 Article 📅 2012 🏛 IEEE ⚖ 446 KB

[IEEE 2012 IEEE 14th Electronics Packagi

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Compact triple-mode microstrip bandpass filter

✍ Songbai Zhang, ; Lei Zhu, ; Rui Li, ; Cheng Jin, 📂 Article 📅 2012 🏛 IEEE ⚖ 529 KB

[IEEE 2012 IEEE 14th Electronics Packagi

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - A 135GHz slotline bandpass filter using silicon/membrane technology

✍ Rui Li, ; Cheng Jin, ; Sampath, K. P.; Min Tang, ; Soon Wee Ho, ; Siong Chiew On 📂 Article 📅 2012 🏛 IEEE ⚖ 430 KB

[IEEE 2012 IEEE 14th Electronics Packagi

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

✍ Gonzalez, M.; Vandevelde, B.; Ivankovic, A.; Cherman, V.; Debecker, B.; Lofrano, 📂 Article 📅 2012 🏛 IEEE ⚖ 944 KB

[IEEE 2012 IEEE 14th Electronics Packagi

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of new TSV structure composing of intermetallic compounds

✍ Daquan Yu, ; Xiaoyang Liu, ; Ran He, ; Xiangmeng Jing, ; Chongshen Song, ; Fengw 📂 Article 📅 2012 🏛 IEEE ⚖ 775 KB

[IEEE 2012 IEEE 14th Electronics Packagi

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Thin glass substrates development and integration for through glass vias (TGV) with Cu interconnect

✍ Bor Kai Wang, ; Yi-An Chen, ; Shorey, A.; Piech, G. 📂 Article 📅 2012 🏛 IEEE ⚖ 765 KB