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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Through-Silicon Interposer (TSI) co-design optimization for high performance systems

✍ Scribed by Cubillo, J. R.; Weerasekera, R.; Katti, G.; Patti, R.

Book ID: 126625828
Publisher: IEEE
Year: 2012
Weight: 446 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507058

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