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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Thin glass substrates development and integration for through glass vias (TGV) with Cu interconnect

✍ Scribed by Bor Kai Wang, ; Yi-An Chen, ; Shorey, A.; Piech, G.

Book ID: 126722293
Publisher: IEEE
Year: 2012
Weight: 765 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507106

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