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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Nano copper conductive ink for RFID application

✍ Scribed by Li, Jian; An, Bing; Qin, Jian; Wu, Yiping

Book ID: 125421696
Publisher: IEEE
Year: 2011
Weight: 121 KB
Category: Article
ISBN: 1467301485
DOI: 10.1109/isapm.2011.6105678

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