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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED

✍ Scribed by Wang, Ling; Wang, Hongqin; Wan, Chao; Wang, Pengcheng; Li, Mingyu; Du, Bin; Deng, Meiling; He, Lijiao

Book ID: 120567914
Publisher: IEEE
Year: 2011
Weight: 105 KB
Category: Article
ISBN: 1467301485
DOI: 10.1109/ISAPM.2011.6105750

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