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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - A comparison of two board level mechanical tests-drop impact and vibration shock

✍ Scribed by Yang, Liu; Fenglian, Sun; Hongwu, Zhang; Zhen, Zhou; Yong, Qin

Book ID: 118070602
Publisher: IEEE
Year: 2011
Weight: 159 KB
Volume: 0
Category: Article
ISBN: 1467301485
DOI: 10.1109/isapm.2011.6105699

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