𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization

✍ Scribed by Wu, H. L. Henry; Lee, S. W. Ricky

Book ID: 120770280
Publisher: IEEE
Year: 2011
Weight: 869 KB
Category: Article
ISBN: 1467301485
DOI: 10.1109/ISAPM.2011.6105719

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 International Symposium on Ad

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Nano copper conductive ink for RFID application

✍ Li, Jian; An, Bing; Qin, Jian; Wu, Yiping 📂 Article 📅 2011 🏛 IEEE ⚖ 121 KB

[IEEE 2011 International Symposium on Ad

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Stress evolution during self-annealing of methanesulfonate bath electroplating cu for TSV

✍ Feng, Xue; Gao, Liming; Li, Ming 📂 Article 📅 2011 🏛 IEEE ⚖ 690 KB

[IEEE 2011 International Symposium on Ad

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Studies of the degradation mechanisms in high power diode lasers

✍ Guoguang, Lu; Yun, Huang; Zhifeng, Lei 📂 Article 📅 2011 🏛 IEEE ⚖ 775 KB

[IEEE 2011 International Symposium on Ad

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Static thermal resistance test and simulation analysis technology for hybrid microcircuit

✍ Zhou, Bin; Qi, Xueli 📂 Article 📅 2011 🏛 IEEE ⚖ 183 KB

[IEEE 2011 International Symposium on Ad

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - A comparison of two board level mechanical tests-drop impact and vibration shock

✍ Yang, Liu; Fenglian, Sun; Hongwu, Zhang; Zhen, Zhou; Yong, Qin 📂 Article 📅 2011 🏛 IEEE ⚖ 159 KB

[IEEE 2011 International Symposium on Ad

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Isocyanate-terminated polydimethylsiloxane-modified epoxy resin: Preparation and curing, characterization and mechanical properties

✍ Gui, D. Y.; Si, D. Q.; Chen, B.; Li, J. X.; Yu, X. 📂 Article 📅 2011 🏛 IEEE ⚖ 250 KB