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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP)

✍ Scribed by Lim Ying Ying, ; Wee, David Ho Soon; Kim Hyoung Joon, ; Damaruganath, Pinjala

Book ID: 124165621
Publisher: IEEE
Year: 2011
Weight: 742 KB
Category: Article
ISBN: 1457719819
DOI: 10.1109/EPTC.2011.6184454

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