𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Embedded Wafer Level BGA (eWLB) - extra-small and eLGA packages

✍ Scribed by Anandan, Ramasamy; Yaohuang Huang, ; Yonggang Jin, ; Kah Wee Gan, ; Puay Gek Chua, ; Yun Liu, ; Caparas Alvin, Jose

Book ID: 120302490
Publisher: IEEE
Year: 2011
Weight: 948 KB
Category: Article
ISBN: 1457719819
DOI: 10.1109/EPTC.2011.6184456

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Moisture characteristics of wafer level compression molding compounds

✍ Rajoo, Ranjan; Xiaowu Zhang, 📂 Article 📅 2011 🏛 IEEE ⚖ 917 KB

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Electrical functionalization of thermoplastic materials by Aerosol Jet Printing

✍ Hoerber, J.; Goth, C.; Franke, J.; Hedges, M. 📂 Article 📅 2011 🏛 IEEE ⚖ 357 KB

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP)

✍ Lim Ying Ying, ; Wee, David Ho Soon; Kim Hyoung Joon, ; Damaruganath, Pinjala 📂 Article 📅 2011 🏛 IEEE ⚖ 742 KB

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Thermal performance evaluation of a synthetic jet heat sink for electronic cooling

✍ Chandratilleke, T T; Narayanaswamy, R; Jagannatha, D 📂 Article 📅 2011 🏛 IEEE ⚖ 784 KB

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Electroless Ni-W-P alloy as a more enduring and reliable soldering metallization

✍ Yang, Y.; Balaraju, J. N.; Tsakadze, Z.; Chen, Z. 📂 Article 📅 2011 🏛 IEEE ⚖ 1004 KB

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Study of interaction between Cu-SnAg and Ni-SnAg interfacial reactions by low solder volume in 3D IC packaging

✍ Hsiang-Yao Hsiao, ; Yi-Sa Huang, ; Chih Chen, 📂 Article 📅 2011 🏛 IEEE ⚖ 928 KB