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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Moisture characteristics of wafer level compression molding compounds

✍ Scribed by Rajoo, Ranjan; Xiaowu Zhang,

Book ID: 120295229
Publisher: IEEE
Year: 2011
Weight: 917 KB
Category: Article
ISBN: 1457719819
DOI: 10.1109/EPTC.2011.6184404

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