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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - A comparative study of ULK conduction mechanisms and TDDB characteristics for Cu interconnects with and without CoWP metal cap at 32nm technology

✍ Scribed by Chen, F.; Huang, E.; Shinosky, M.; Angyal, M.; Kane, T.; Wang, Y.; Kolics, A.

Book ID: 126206829
Publisher: IEEE
Year: 2010
Weight: 460 KB
Category: Article
ISBN: 1424476763
DOI: 10.1109/IITC.2010.5510693

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