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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding

✍ Scribed by Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe

Book ID: 125502409
Publisher: IEEE
Year: 2010
Weight: 236 KB
Category: Article
ISBN: 1424476763
DOI: 10.1109/IITC.2010.5510444

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