[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology

✍ Scribed by Teh, W.H.; Deeb, C.; Burggraf, J.; Wimplinger, M.; Matthias, T.; Young, R.; Senowitz, C.; Buxbaum, A.

• Book ID: 124155949
• Publisher: IEEE
• Year: 2010
• Weight: 629 KB
• Category: Article
• ISBN: 1424476763
• DOI: 10.1109/IITC.2010.5510387