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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Lead-free flip chip solution for 40 nm extreme low-k interconnect system

✍ Scribed by Hou, S.Y.; Shih, C.W.; Wu, W.C.; Hsieh, C.H.; Su, A.J.; Tung, C.H.; Jeng, S.P.; Li, M.J.; Yu, Doug. C.H.

Book ID: 120165373
Publisher: IEEE
Year: 2010
Weight: 465 KB
Category: Article
ISBN: 1424476763
DOI: 10.1109/IITC.2010.5510307

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