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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

✍ Scribed by Cadix, L.; Rousseau, M.; Fuchs, C.; Leduc, P.; Thuaire, A.; Farhane, R. El; Chaabouni, H.; Anciant, R.; Huguenin, J.-L.; Coudrain, P.; Farcy, A.; Bermond, C.; Sillon, N.; Flechet, B.; Ancey, P.

Book ID: 124155951
Publisher: IEEE
Year: 2010
Weight: 567 KB
Category: Article
ISBN: 1424476763
DOI: 10.1109/IITC.2010.5510728

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