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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Electrical evaluation of 130-nm MOSFETs with TSV proximity in 3D-SIC structure

✍ Scribed by Yang, Yu; Katti, Guruprasad; Labie, Riet; Travaly, Youssef; Verlinden, Bert; De Wolf, Ingrid

Book ID: 124155950
Publisher: IEEE
Year: 2010
Weight: 401 KB
Category: Article
ISBN: 1424476763
DOI: 10.1109/IITC.2010.5510710

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