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[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Developing digital test sequences for through-silicon vias within 3D structures

✍ Scribed by Gulbins, Matthias; Hopsch, Fabian; Schneider, Peter; Straube, Bernd; Vermeiren, Wolfgang

Book ID: 121740995
Publisher: IEEE
Year: 2010
Weight: 102 KB
Category: Article
ISBN: 1457705265
DOI: 10.1109/3DIC.2010.5751442

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