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[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - 3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's

✍ Scribed by Ishida, Koichi; Takemura, Koichi; Baba, Kazuhiro; Takamiya, Makoto; Sakurai, Takayasu

No coin nor oath required. For personal study only.

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