𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

✍ Scribed by Gaudin, Gweltaz; Riou, Gregory; Landru, Didier; Tempesta, Catherine; Radu, Ionut; Sadaka, Mariam; Winstel, Kevin; Kinser, Emily; Hannon, Robert

Book ID: 120210366
Publisher: IEEE
Year: 2010
Weight: 199 KB
Category: Article
ISBN: 1457705265
DOI: 10.1109/3DIC.2010.5751472

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 IEEE International 3D Systems

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Cost effectiveness of 3D integration options

✍ Velenis, Dimitrios; Marinissen, Erik Jan; Beyne, Eric 📂 Article 📅 2010 🏛 IEEE ⚖ 264 KB

[IEEE 2010 IEEE International 3D Systems

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Developing digital test sequences for through-silicon vias within 3D structures

✍ Gulbins, Matthias; Hopsch, Fabian; Schneider, Peter; Straube, Bernd; Vermeiren, 📂 Article 📅 2010 🏛 IEEE ⚖ 102 KB

[IEEE 2010 IEEE International 3D Systems

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

✍ Oosterhuis, Gerrit; in't Veld, Bert Huis; Ebberink, Gerald; del Cerro, Daniel Ar 📂 Article 📅 2010 🏛 IEEE ⚖ 810 KB

[IEEE 2010 IEEE International 3D Systems

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - 3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's

✍ Ishida, Koichi; Takemura, Koichi; Baba, Kazuhiro; Takamiya, Makoto; Sakurai, Tak 📂 Article 📅 2010 🏛 IEEE ⚖ 265 KB

[IEEE 2010 IEEE International Test Confe

[IEEE 2010 IEEE International Test Conference (ITC) - Austin, TX, USA (2010.11.2-2010.11.4)] 2010 IEEE International Test Conference - On maximizing the compound yield for 3D Wafer-to-Wafer stacked ICs

✍ Taouil, Mottaqiallah; Hamdioui, Said; Verbree, Jouke; Marinissen, Erik Jan 📂 Article 📅 2010 🏛 IEEE ⚖ 465 KB

[IEEE 2012 3rd IEEE International Worksh

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Overview of wafer direct bonding technology: From substrate engineering to heterogeneous integration enabled by 3D wafer stacking

✍ Radu, Ionut 📂 Article 📅 2012 🏛 IEEE ⚖ 567 KB