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[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Overview of wafer direct bonding technology: From substrate engineering to heterogeneous integration enabled by 3D wafer stacking

✍ Scribed by Radu, Ionut

Book ID: 121786247
Publisher: IEEE
Year: 2012
Weight: 567 KB
Category: Article
ISBN: 1467307416
DOI: 10.1109/LTB-3D.2012.6238043

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