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[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Copper-oxide reduction for low-temperature wafer bonding

✍ Scribed by Rebhan, B.; Tollabimazraehno, S.; Plach, T.; Hesser, G.; Burggraf, J.; Mittendorfer, G.; Dragoi, V.; Wimplinger, M.; Hingerl, K.

Book ID: 120598694
Publisher: IEEE
Year: 2012
Weight: 738 KB
Category: Article
ISBN: 1467307416
DOI: 10.1109/LTB-3D.2012.6238047

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