𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - 3D-TSV vertical interconnection method using Cu/SnAg double bumps

✍ Scribed by Paik, Kyung-Wook; Choi, Yongwon; Shin, Jiwon

Book ID: 120600010
Publisher: IEEE
Year: 2012
Weight: 517 KB
Category: Article
ISBN: 1467307416
DOI: 10.1109/LTB-3D.2012.6238093

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 3rd IEEE International Worksh

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature plasma activated direct wafer bonding

✍ Plach, T.; Hingerl, K.; Dragoi, V.; Wimplinger, M. 📂 Article 📅 2012 🏛 IEEE ⚖ 634 KB

[IEEE 2012 3rd IEEE International Worksh

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Copper-oxide reduction for low-temperature wafer bonding

✍ Rebhan, B.; Tollabimazraehno, S.; Plach, T.; Hesser, G.; Burggraf, J.; Mittendor 📂 Article 📅 2012 🏛 IEEE ⚖ 738 KB

[IEEE 2012 3rd IEEE International Worksh

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Hybrid integration of LiNbO3 thin films on micromachined Si substrates using room-temperature transfer bonding

✍ Takigawa, R.; Higurashi, E.; Suga, T.; Kawanishi, T. 📂 Article 📅 2012 🏛 IEEE ⚖ 644 KB

[IEEE 2012 3rd IEEE International Worksh

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Overview of wafer direct bonding technology: From substrate engineering to heterogeneous integration enabled by 3D wafer stacking

✍ Radu, Ionut 📂 Article 📅 2012 🏛 IEEE ⚖ 567 KB