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[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

✍ Scribed by Oosterhuis, Gerrit; in't Veld, Bert Huis; Ebberink, Gerald; del Cerro, Daniel Arnaldo; van den Eijnden, Edwin; Chall, Peter; van der Zon, Ben

Book ID: 121379559
Publisher: IEEE
Year: 2010
Weight: 810 KB
Category: Article
ISBN: 1457705265
DOI: 10.1109/3DIC.2010.5751481

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