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[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Processing material evaluation and ultra-wideband modeling of through-strata-via (TSV) in 3D integrated circuits and systems

✍ Scribed by Xu, Zheng; Beece, Adam; Zhang, Dingyou; Chen, Qianwen; Rose, Kenneth; Lu, James Jian-Qiang

Book ID: 120003696
Publisher: IEEE
Year: 2010
Weight: 548 KB
Category: Article
ISBN: 1424457971
DOI: 10.1109/ICSICT.2010.5667669

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