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[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Through-silicon via (TSV) capacitance modeling for 3D NoC energy consumption estimation

✍ Scribed by Jueping, Cai; Peng, Jiang; Lei, Yao; Yue, Hao; Zan, Li

Book ID: 115525630
Publisher: IEEE
Year: 2010
Weight: 374 KB
Volume: 0
Category: Article
ISBN: 1424457971
DOI: 10.1109/icsict.2010.5667434

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