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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Performance analyse on millimetre-wave bonding-wire interconnection

✍ Scribed by Li, Jiankang; Xiong, Yong-Zhong; Hu, Sanming; Goh, Wang Ling; Hou, Debin; Wu, Wen

Book ID: 125855281
Publisher: IEEE
Year: 2010
Weight: 849 KB
Category: Article
ISBN: 1424490685
DOI: 10.1109/EDAPS.2010.5683034

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