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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Design of a miniaturized balun using Low Temperature Co-fired Ceramic Technology

✍ Scribed by Wan-bing, Jiang; Long, Jin; Ji-gang, Hu; Shi-zhao, Yang

Book ID: 118021761
Publisher: IEEE
Year: 2010
Weight: 100 KB
Volume: 0
Category: Article
ISBN: 1424490685
DOI: 10.1109/edaps.2010.5682998

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