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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics

✍ Scribed by Ji, Yuancheng; Mouthaan, Koen; Venkatarayalu, Neelakantam V.

Book ID: 118253213
Publisher: IEEE
Year: 2010
Weight: 269 KB
Volume: 0
Category: Article
ISBN: 1424490685
DOI: 10.1109/edaps.2010.5683003

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