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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - System-level characterization of modal signaling for high-density off-chip interconnects

✍ Scribed by Milosevic, P.; Schutt-Aine, J. E.

Book ID: 111978886
Publisher: IEEE
Year: 2011
Weight: 191 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/edaps.2011.6213748

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