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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Research on TSV positioning in 3D IC placement

✍ Scribed by Ligang Hou, ; Shu Bai, ; Jinhui Wang,

Book ID: 115488527
Publisher: IEEE
Year: 2011
Weight: 375 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/edaps.2011.6213801

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