𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

✍ Scribed by Boping Wu, ; Haogang Wang,

Book ID: 111964647
Publisher: IEEE
Year: 2011
Weight: 292 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/edaps.2011.6213775

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Research on TSV positioning in 3D IC placement

✍ Ligang Hou, ; Shu Bai, ; Jinhui Wang, 📂 Article 📅 2011 🏛 IEEE ⚖ 375 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - PCB trace modeling and equalizer design method for 10 Gbps backplane

✍ Muraoka, S.; Shinkai, G.; Yagyu, M.; Uematsu, Y.; Ogihara, M.; Sezaki, N.; Osaka 📂 Article 📅 2011 🏛 IEEE ⚖ 898 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - System-level characterization of modal signaling for high-density off-chip interconnects

✍ Milosevic, P.; Schutt-Aine, J. E. 📂 Article 📅 2011 🏛 IEEE ⚖ 191 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A simple UHF RFID circularly-polarized reader antenna design

✍ Lu, Y.-L; Cui, H.-R; Sun, X.-W; Xu, M.; Yin, Y.-Z 📂 Article 📅 2011 🏛 IEEE ⚖ 301 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - New frequency dependent target impedance for DDR3 memory system

✍ Sasaki, H.; Kanazawa, M.; Sudo, T.; Tomishima, A.; Kaneko, T. 📂 Article 📅 2011 🏛 IEEE ⚖ 681 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Novel techniques for Montgomery modular multiplication algorithms for public key cryptosystems

✍ Venkatasubramani, V. R.; Rajaram, S. 📂 Article 📅 2011 🏛 IEEE ⚖ 118 KB