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[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - FdSPICE: A parallel simulation technique for lossy and dispersive interconnect networks

✍ Scribed by Wang, Jian; Tang, Min; Ma, Lizhuang; Mao, Junfa

Book ID: 120165351
Publisher: IEEE
Year: 2010
Weight: 206 KB
Category: Article
ISBN: 1424490685
DOI: 10.1109/EDAPS.2010.5683035

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