𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Design and simulation of a compact novel LTCC antenna for integrated Bluetooth applications

✍ Scribed by Ji-gang, Hu; Long, Jin; Wan-bing, Jiang; Shi-zhao, Yang

Book ID: 125812368
Publisher: IEEE
Year: 2010
Weight: 719 KB
Category: Article
ISBN: 1424490685
DOI: 10.1109/EDAPS.2010.5682995

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Wideband bandpass filter design for D-band application

✍ Li, Rui; Lim, Teck Guan; Ho, Soon Wee; Xiong, Yong Zhong; Khoo, Yee Mong 📂 Article 📅 2010 🏛 IEEE ⚖ 854 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics

✍ Ji, Yuancheng; Mouthaan, Koen; Venkatarayalu, Neelakantam V. 📂 Article 📅 2010 🏛 IEEE ⚖ 269 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Performance analyse on millimetre-wave bonding-wire interconnection

✍ Li, Jiankang; Xiong, Yong-Zhong; Hu, Sanming; Goh, Wang Ling; Hou, Debin; Wu, We 📂 Article 📅 2010 🏛 IEEE ⚖ 849 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - FdSPICE: A parallel simulation technique for lossy and dispersive interconnect networks

✍ Wang, Jian; Tang, Min; Ma, Lizhuang; Mao, Junfa 📂 Article 📅 2010 🏛 IEEE ⚖ 206 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Design of a miniaturized balun using Low Temperature Co-fired Ceramic Technology

✍ Wan-bing, Jiang; Long, Jin; Ji-gang, Hu; Shi-zhao, Yang 📂 Article 📅 2010 🏛 IEEE ⚖ 100 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - High-speed electromagnetic field simulation by HIE-FDTD method with GPGPU

✍ Unno, Masaki; Asai, Hideki 📂 Article 📅 2010 🏛 IEEE ⚖ 341 KB