𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - A dual-band filter using stepped-impedance resonator (SIR) embedded into substrate integrated waveguide (SIW)

✍ Scribed by Wu, Lin-Sheng; Mao, Jun-Fa; Yin, Wen-Yan; Guo, Yong-Xin

Book ID: 120637820
Publisher: IEEE
Year: 2010
Weight: 341 KB
Category: Article
ISBN: 1424490685
DOI: 10.1109/EDAPS.2010.5683025

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Wideband bandpass filter design for D-band application

✍ Li, Rui; Lim, Teck Guan; Ho, Soon Wee; Xiong, Yong Zhong; Khoo, Yee Mong 📂 Article 📅 2010 🏛 IEEE ⚖ 854 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Design of a miniaturized balun using Low Temperature Co-fired Ceramic Technology

✍ Wan-bing, Jiang; Long, Jin; Ji-gang, Hu; Shi-zhao, Yang 📂 Article 📅 2010 🏛 IEEE ⚖ 100 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics

✍ Ji, Yuancheng; Mouthaan, Koen; Venkatarayalu, Neelakantam V. 📂 Article 📅 2010 🏛 IEEE ⚖ 269 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - FdSPICE: A parallel simulation technique for lossy and dispersive interconnect networks

✍ Wang, Jian; Tang, Min; Ma, Lizhuang; Mao, Junfa 📂 Article 📅 2010 🏛 IEEE ⚖ 206 KB

[IEEE 2010 IEEE Electrical Design of Adv

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - High-speed electromagnetic field simulation by HIE-FDTD method with GPGPU

✍ Unno, Masaki; Asai, Hideki 📂 Article 📅 2010 🏛 IEEE ⚖ 341 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A 60-GHz band WPAN transmitter module integrated with a planar dipole antenna using organic substrates and 3-D SiP technology

✍ Yoshida, Satoshi; Tanifuji, Shoichi; Kameda, Suguru; Suematsu, Noriharu; Takagi, 📂 Article 📅 2011 🏛 IEEE ⚖ 504 KB