𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A 60-GHz band WPAN transmitter module integrated with a planar dipole antenna using organic substrates and 3-D SiP technology

✍ Scribed by Yoshida, Satoshi; Tanifuji, Shoichi; Kameda, Suguru; Suematsu, Noriharu; Takagi, Tadashi; Tsubouchi, Kazuo

Book ID: 111978889
Publisher: IEEE
Year: 2011
Weight: 504 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/edaps.2011.6213759

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A simple UHF RFID circularly-polarized reader antenna design

✍ Lu, Y.-L; Cui, H.-R; Sun, X.-W; Xu, M.; Yin, Y.-Z 📂 Article 📅 2011 🏛 IEEE ⚖ 301 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Research on TSV positioning in 3D IC placement

✍ Ligang Hou, ; Shu Bai, ; Jinhui Wang, 📂 Article 📅 2011 🏛 IEEE ⚖ 375 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Energy-efficient high-speed links using BER-optimal ADCs

✍ Lin, Yingyan; Xu, Aolin; Shanbhag, Naresh; Singer, Andrew 📂 Article 📅 2011 🏛 IEEE ⚖ 179 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A 1.5–3.0GHz wideband VCO with low gain variation

✍ Yinfei Weng, ; Haijun Gao, ; Lingling Sun, 📂 Article 📅 2011 🏛 IEEE ⚖ 185 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Polynomial chaos helps assessing parameters variations of PCB lines

✍ Manfredi, Paolo; Stievano, Igor S.; Canavero, Flavio G. 📂 Article 📅 2011 🏛 IEEE ⚖ 229 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - PCB trace modeling and equalizer design method for 10 Gbps backplane

✍ Muraoka, S.; Shinkai, G.; Yagyu, M.; Uematsu, Y.; Ogihara, M.; Sezaki, N.; Osaka 📂 Article 📅 2011 🏛 IEEE ⚖ 898 KB