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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Pure palladium in ENEPIG surface finishes — Physical properties of the Pd deposition and their influence on soldering and wire bonding

✍ Scribed by Kao, Bill; Oezkoek, Mustafa; Roberts, Hugh

Book ID: 126725511
Publisher: IEEE
Year: 2010
Weight: 311 KB
Category: Article
ISBN: 1424497833
DOI: 10.1109/IMPACT.2010.5699489

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